Specialist Processes
Typically only provided by major, high-volume contract manufacturers, EMA offers state-of-the-art and specialist manufacturing processes to help mid-to-low volume customers optimise the use of board space and take advantage of the latest surface-mount technology.
Here are just some of the ways that EMA can improve the build-quality and field-reliability of your products.
Stress-Free Depanelisation
Ideal for sub-miniature products such as RF sub-assemblies, where board-edge component placement can save up to 40% of the total board space. The robotic bottom-side router slices through the PCB, eliminating substrate and component stress. This process allows components to be placed within 0.3mm of the board edge, compared to the traditional 3-5mm required for scored panels.
Conductive Adhesive Dispensing
An alternative to soldering surface mount components, conductive adhesive is suitable for non-electrical and ultra-fine-pitch electronic components where it provides a conductive bond that offers an excellent buffer against mechanical shock. The dispenser is programmed for high-accuracy placement of controlled quantities of adhesive onto the board. The final curing process takes place at a lower temperature than is used for reflow soldering.
Lead-Free Soldering
EMA was an early-adopter of lead-free solders and our lead-free processes are fully compliant with the RoHS directive. Our experience shows that fine-resolution lead-free solder paste achieves higher screen accuracy and manufacturing yields compared to traditional lead solder. All of our reflow and wave soldering systems are fully qualified for lead-free manufacture.
RF & Custom Test Equipment
Specialist RF equipment includes screened RF test rooms, spectrum analysers, signal generators and calibrated antennae. Together with Automated Optical Inspection and custom-built test equipment, these deliver automotive-standard testing and failure analysis to significantly increase manufacturing yield and product field-reliability.
